Precision thermo testing machine for semiconductor,chips

Short Description:

Application HJ-TS-560 is a precise high and low temperature impact airflow meter, with a wider temperature range-65℃ to +225℃, providing a very advanced temperature conversion test capability. The fastest temperature conversion from -55°C to +125°C takes only 13 seconds; after long-term multi-condition verification, it meets the requirements of various production environments and engineering envinments. TS-560 is purely mechanical refrigeration, without liquid nitrogen or any other consu...

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Application

HJ-TS-560 is a precise high and low temperature impact airflow meter, with a wider temperature range-65℃ to +225℃, providing a very advanced temperature conversion test capability. The fastest temperature conversion from -55°C to +125°C takes only 13 seconds; after long-term multi-condition verification, it meets the requirements of various production environments and engineering envinments. TS-560 is purely mechanical refrigeration, without liquid nitrogen or any other consumable refrigerants.

Features

1.The temperature change rate is fast, the fastest conversion between -55°C and +125°C takes only 13 seconds. Wide temperature range, -65°C to +225°C Compact structure, mobile design, touch screen operation, human-computer interaction interface, fast DUT temperature stabilization time. 2.Temperature control accuracy ±1℃, display accuracy ±0.1℃ 3.Air flow can be as high as 18SCFM 4.Patented defrosting design to quickly remove internal water vapor accumulation

Standard test 1.Meet the U.S. military standard MIL system test standards 2.Meet the GJB system test standards of domestic military components 3.Meet JEDEC test requirements

Characteristic analysis,
high and low temperature temperature change test, temperature shock test, failure analysis and other reliability tests, Such as: chips, microelectronics, integrated circuits (SOC, FPGA, PLD, MCU, ADC/DAC, DSP, etc.) flash memory Flash, UFS, eMMC, PCBs, MCMs, MEMS, IGBT, sensors, small module components, optical communications ( Such as: Transceiver high and low temperature test, SFP optical module high and low temperature test, etc.) Other electronic industry, new aerospace materials.

Technical specifications
Temperature range	-65 ºC to + 225 ºC
Typical temperature conversion rate	-55 ºC to + 125 ºC; ≤13 seconds
Temperature control accuracy	± 1 ºC
Display/setting accuracy	± 0.1 ºC
ystem air flow	4 ~ 18 SCFM（1.9L/s ~ 8.5L/s）
System operation	High-definition color touch screen, 7″TFT
System language	Chinese /English
Operation mode	Manual mode or program mode
Detection mode	Air, DUT
Temperature control	Internal: TC; Remote/External: T, K; Optional: RTD
Communication Interface	RS-232, LAN; Optional: GPIB
Refrigerant	HCFC Environmentally friendly refrigerant
Lift control	Lifting rod: electric; HEAD: pneumatic control; operation via local or remote interface
Arm extension	X：1300mm， Y：400mm， Z：360°
Heat shield size	Standard: 140mm; Others: Φ74mm/Φ178mm (Various sizes are available for customization)
Host size	638mm * 970mm * 970mm(Lengthwidthheight)
Noise	≤59dBA
Weight	205Kg
Power requirements	220VAC/50Hz，30Amp，1Phase